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Welcome to MOSIS
From prototype to production, MOSIS is a design engineer's single
source for a wide variety of semiconductor processes offered by major
foundries.
Costs are kept low by combining designs from many customers into
multi-project wafer (MPW) runs. With prototype costs reduced,
engineers can submit several variations of the same design to the same
run, thus
shortening time-to-market.
Final designs can then be submitted to MOSIS for low- medium volume
production or dedicated Engineering wafer runs (COT).
Along with wafers and die, MOSIS provides a full range of packaging
and bonding options for designs fabricated through our service.
MOSIS, CMP, and CMC Partner to Introduce a 3D-IC Process
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Fabrication Schedule
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JUL 19
ON-SEMI C5F/C5N
TSMC 0.18 µm
TSMC 0.25 µm
TSMC 40 nm
TSMC 45 nm
JUL 26
AMS C18
ON-SEMI C5F/C5N
PEREGRINE GC
TSMC 0.13 µm
TSMC 65 nm
AUG 02
AMS H35B4D3
IBM 7HV
ON-SEMI I3T50
TSMC 0.18 µm
TSMC 0.25 µm
TSMC 90 nm
AUG 09
IBM 10LPE
IBM 8RF
TSMC 0.18 µm
TSMC 65 nm
AUG 16
AMS C35B4C3
AMS C35B4O1
IBM 7RF
IBM 7RFSOI
TSMC 0.18 µm
TSMC 0.35 µm
TSMC 40 nm
TSMC 45 nm
AUG 23
TSMC 0.13 µm
TSMC 65 nm
More...
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