|
|
MOSIS provides electrical test data and SPICE parameters for most
wafer lots.
Wafer Electrical Test Data and SPICE Model Parameters
Active Processes
Lot-specific parametric results and SPICE device model
parameters are extracted from measurements on wafers probed at MOSIS.
SPICE level 3 model parameters for
classroom
instructional purposes, not for actual IC design work are also
available.
|
AMIS 0.50 micron (C5)
|
|
AMIS 0.35 micron (C3O)
|
|
AMIS 1.50 micron (ABN)
|
|
|
IBM 0.50 micron (5HP, 5AM, 5DM, 5PA)
|
|
IBM 0.35 micron (5HPE)
|
|
IBM 0.25 micron (6HP, 6DM, 6RF)
|
|
IBM 0.18 micron (7RF, 7WL, 7SF, 7HP)
|
|
IBM 0.13 micron (8RF-LM, 8RF-DM)
|
|
IBM 90 nanometer (9SF, 9LP, 9RF)
|
|
|
TSMC 0.18 micron
|
|
TSMC 0.25 micron
|
|
TSMC 0.35 micron
|
|
|
Related Links
SPICE Parameters for Submicron Technologies (MOSIS perspectives)
MOSIS Process Monitor (used for test data measurements)
SPICE Simulation Summary (MOSIS Runs)
MOSIS FAQ: Wafer Electrical Specifications
MOSIS FAQ: Spice Model Parameters
|
|
|