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The most frequently asked questions about fabrication processes
available through MOSIS.
MOSIS FAQs
Fabrication Processes
1.0 What fabrication processes are available through MOSIS?
2.0 How can I obtain more information about a particular process?
3.0 How can I obtain layer thickness information for MOSIS
wafers?
4.0 Can I obtain information like doping levels for a particular
process?
5.0 Which MOSIS processes support MEMS fabrication?
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1. What fabrication processes are available through MOSIS?
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All of the fabrication processes available through MOSIS are listed on
the MOSIS web page,
Fabrication Processes Available Through MOSIS
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2. How can I obtain more information about a particular process?
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Our vendors consider their design rules, process specifications, and
SPICE corner parameters to be proprietary and have established
different avenues for their distribution.
Please see
Fabricator
Design Rules, SPICE parameters for MOSIS Processes for the most
current information by vendor.
SPICE parameters may be used as design references, but no
quantity derived from a simulation should be treated as a
manufacturing tolerance
3. How can I obtain layer thickness information for MOSIS wafers?
Layer thickness information is normally included in a wafer
fabricator's process specifications. These can be obtained
by following the instructions in Section 2 above.
4. Can I obtain information like doping levels for a particular
process?
Fabricators do not provide this type of information about
their processes.
5. Which MOSIS processes support MEMS fabrication?
Currently, it is only possible to construct MEMS devices in MOSIS
technologies which have minimum feature sizes greater than 1.0
µm.
This restriction exists because the submicrometer technology design
rules prohibit using oversize contacts and vias. Also, most of the
submicrometer technologies use silicided active area, which is not
compatible with MEMS structure release etch chemistry.
For more information, see
MEMS Available through MOSIS.
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