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Third Party Services

3rd Party Design Services

COMPANY SERVICE
Agile Enterprises Inc
(formerly Mulvin & Company)
Test sockets
Amitec Substrate supplier
Artwork Conversion Software (ACS) Plotting services
ASAT High volume plastic packages
Aspen Technologies IC assembly services
Chelsea Technology, Inc Ceramic packages
ChipEstimate.Com Chip size estimation
CORWIL Technology Corporation IC assembly services
CMP Technology, Inc. CMP density equalization software
CVInc Die bumping, package design and assembly
E-tec Interconnect Test sockets and contactors
Entegris Carriers for die and wafer
Evergreen Semiconductor Materials, Inc Ceramic packages, lids, and silicon wafers.
FastFieldSolvers Package modeling
FASTXchange Electronic purchasing service
GEL-PAK Carriers for die and wafer
Global Chip Materials Ceramic and premolded plastic packages
Golden Altos IC assembly services
High Connection Density Inc Test and burn in sockets
I2A Technologies (formerly IPAC) IC assembly (plastic)
Integra Technologies Testing services
MEFAS, Inc. FA, FIB, & reliability testing services
Melgar Photographers Micro-photography services
Modelithics Characterization and modeling
Multilayer Technology (Multek) PCB, MCM-L fabrication
NNTTF (Australia) Testing services
Promex Industries, Inc. IC assembly services
Quik-Pak IC assembly services (open cavity plastic packages)
Spectrum Semiconductor Materials, Inc. Ceramic packages
SEMPAC Open cavity plastic packages
Syagrus Systems IC assembly services
TLMI Corporation Flip chip bumping
VerIC Systems Layout verification
yieldWerx Semiconductor test data analysis


3rd Party Design Services


Organizations offering products and services to the VLSI design community can ask to be added to this list. Send your request, a description of your company, and contact information to support@mosis.com.




Please note MOSIS does not necessarily endorse the products and services listed on ths page.



Related Links
  • Third Party Design Services
  • MOSIS FAQs: Packaging
  • MOSIS Products



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