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Device Modeling Tools



Tool   Organization or Company

BSIM3 (SPICE 3f5) University of California at Berkeley
Hspice Synopsys
PSpice Cadence-Orcad
Virtuoso Spectre MMSIM Cadence
SmartSpice Simucad
T-Spice Tanner

Organizations which offer device modeling tools to the VLSI design community are invited to request that MOSIS include their web site on this page. Send e-mail to support@mosis.com.

Additional information:

Ron Kielkowski, Inside SPICE: Overcoming the Obstacles of Circuit Simulation, 2nd ed., New York: McGraw-Hill, Inc., 1998. ISBN 0-07-913712-1



Related Links
  • SPICE Parameters for Submicron Technologies (MOSIS perspectives)
  • MOSIS Process Monitor (used for test data measurements)
  • SPICE Simulation Summary (MOSIS Runs)
  • MOSIS FAQs: Spice Model Parameters
  • Wafer Electrical Test Data and SPICE Model Parameters





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