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MOSIS Ceramic Packaging Connections and Information
DIP28

MOSIS offers, as a standard part, a 28 lead dual-inline package (DIP). This package is Kyocera KD-77385 or equivalent with a 0.310" cavity (topside). The following diagram depicts the bonding pad to pin connectivity as viewed from the top of the package (or the top of the socket into which the package is plugged), with the index at the upper right corner.


14                                     1
+----------------------------------------+
|                                        |
|                                        |
|                                        |
|                                     ---|
|                                     |  |
|                                     ---|
|                                        |
|                                        |
|                                        |
+----------------------------------------+
15                                    28
                Top View




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