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MOSIS Ceramic Packaging Connections and Information
DIP40
MOSIS offers as a standard part an 40 lead dual-inline package (DIP).
This package is Kyocera KD-78163 or equivalent with a 0.310" cavity
(topside). The following diagram depicts the bonding pad to pin
connectivity as viewed from the top of the package (or the top of the
socket into which the package is plugged), with the index at the upper
right corner.
20 1
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+----------------------------------------+
21 40
Top View
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