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MOSIS Ceramic Packaging Connections and Information
LCC84L

MOSIS offers as a standard part an 84 leadless chip carrier package. This package is Kyocera PB-02689 or equivalent with a 0.470" cavity (topside) and is 1.150" square. The following diagram depicts the bonding pad to pin connectivity as viewed from the top of the package (or the top of the socket into which the package is plugged), with the index on the middle of the right side.

                 32                                    12
                +----------------------------------------+
             33 |                                        | 11
                |                                        |
                |                                        |
                |                                        |
                |                                        |
                |                                        |
                |                                        |
                |                                        |
                |                                        |
                |                                        |
                |                                        | 1
                |                                        | 84
                |                                        | 
                |                                        |
                |                                        |
                |                                        |
                |                                        |
                |                                        |
                |                                        |
                |                                        |
             53 |                                        | 75
                +----------------------------------------+
                 54                                    74
                                Top View



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