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MOSIS Ceramic Packaging Connections and Information
PGA132
MOSIS offers as a standard part an 132 pin grid array package. This
package is available in two cavity sizes. The first is Kyocera
KD-83560-A or equivalent with a 0.450" cavity (topside). The second is
Kyocera KD-P87350 or equivalent with a 0.350" cavity (also
topside). Both are 1.400" square packages and have the same bonding
finger to pin mapping. The pins of these packages are arranged on an
14 x 14 pin grid at 0.1" centers. There are three full rows of pins
around the outside. The following diagram depicts the bonding pad to
pin connectivity as viewed from the top of the package (or the top of
the socket into which the package is plugged), with the index at the
upper right corner. (This view corresponds to the MOSIS layout that
has pin #1 in the upper right hand corner and proceeds
counterclockwise around the die.) The columns of the grid are labelled
alphabetically and the rows numerically.
P N M L K J H G F E D C B A
+--------------------------------------------------------+
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1 | 32 29 26 24 23 20 19 14 13 10 7 5 2 131 | 1
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2 | 35 33 30 27 25 21 18 15 12 9 6 3 132 128 | 2
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3 | 38 36 34 31 28 22 17 16 11 8 4 1 129 125 | 3
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4 | 40 39 37 130 126 123 | 4
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5 | 43 42 41 127 124 122 | 5
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6 | 46 45 44 121 120 119 | 6
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7 | 47 48 49 116 117 118 | 7
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8 | 52 51 50 115 114 113 | 8
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9 | 53 54 55 110 111 112 | 9
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10 | 56 58 61 107 108 109 | 10
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11 | 57 60 64 103 105 106 | 11
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12 | 59 63 67 70 74 77 82 83 88 94 97 100 102 104 | 12
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13 | 62 66 69 72 75 78 81 84 87 91 93 96 99 101 | 13
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14 | 65 68 71 73 76 79 80 85 86 89 90 92 95 98 | 14
+--------------------------------------------------------+
P N M L K J H G F E D C B A
Pad to Pin Layout -- TOP View
CAUTION: the pad-to-pin layout varies for different 132 pin products,
even those from a single vendor. For our purposes, equivalent parts
have the same pin grid, the same pad to pin layout, and the same pad
to cavity (substrate) connection. Be sure to use this diagram for
MOSIS-supplied parts unless or until instructed otherwise.
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