|
|
MOSIS Ceramic Packaging Connections and Information
PGA209
MOSIS offers as a standard part a 209 pin grid array package. The
Kyocera KD-P88639 or equivalent package has a 0.551" cavity (topside)
and is 1.693" square. The pins of this package are arranged on a 17 x
17 pin grid at 0.1" centers. There are four full rows of pins around
the outside.
The following diagram depicts the bonding pad to pin connectivity as
viewed from the top of the package (or the top of the socket into
which the package is plugged), with the index at the upper right
corner. (This view corresponds to the MOSIS layout that has pin #1 in
the upper right hand corner and proceeds counterclockwise around the
die.) The columns of the grid are labeled alphabetically and the rows
numerically.
A B C D E F G H J K L M N P R S T
+---------------------------------------------------------------------+
1 | 56 45 43 40 38 35 33 29 28 24 20 18 15 13 9 8 4 | 1
| |
2 | 60 51 49 47 44 39 34 30 25 23 19 14 10 5 3 207 201 | 2
| |
3 | 61 55 52 50 46 41 36 32 27 22 17 12 7 2 208 205 199 | 3
| |
| |
4 | 65 57 54 53 48 42 37 31 26 21 16 11 6 1 206 203 196 | 4
| |
5 | 67 62 59 58 204 202 200 194 | 5
| |
6 | 70 66 64 63 198 197 195 191 | 6
| |
7 | 72 71 69 68 193 192 190 189 | 7
| |
8 | 76 75 74 73 187 188 186 185 | 8
| |
9 | 80 77 79 78 182 183 181 184 | 9
| |
10 | 81 82 84 83 177 178 179 180 | 10
| |
11 | 85 86 88 89 172 173 175 176 | 11
| |
12 | 87 91 93 94 167 168 170 174 | 12
| |
13 | 90 96 98 100 162 163 166 171 | 13
| |
14 | 92 99 102 105 110 115 120 125 130 135 141 146 152 157 158 161 169 | 14
| |
15 | 95 101 104 106 111 116 121 126 131 136 140 145 150 154 156 159 165 | 15
| |
16 | 97 103 107 109 114 118 123 127 129 134 138 143 148 151 153 155 164 | 16
| |
17 | 108 112 113 117 119 122 124 128 132 133 137 139 142 144 147 149 160 | 17
+---------------------------------------------------------------------+
A B C D E F G H J K L M N P R S T
Pad to Pin Layout -- TOP View
CAUTION: the pad-to-pin layout varies for different 209 pin products,
even those from a single vendor. For our purposes, equivalent parts
have the same pin grid, the same pad to pin layout, and the same pad
to cavity (substrate) connection. Be sure to use this diagram for
MOSIS-supplied parts unless or until instructed otherwise
|
Related Links
Ceramic Packages
Packaging Options
Packaging Prices
|
|
|
