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MOSIS Ceramic Packaging Connections and Information
PGA65
This is a 1.000" square package with a 0.400" cavity (topside) with
Kyocera part number KD-P86542-A. The pins of this package are arranged
on an 10 x 10 pin grid at 0.1" centers. There are two full rows of
pins around the outside. The following diagram depicts the bonding pad
to pin connectivity as viewed from the top of the package (or the top
of the socket into which the package is plugged), with the index at
the upper right corner. (This view corresponds to the MOSIS bonding
diagram that has pin #1 in the upper right hand corner and proceeds
counterclockwise around the die.) The columns of the grid are labelled
alphabetically and the rows numerically.
X
/
K J H G F E D C B A /
+----------------------------------------+
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1 | 17 15 13 11 9 7 6 4 3 1 | 1
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2 | 19 16 14 12 10 8 5 2 64 63 | 2
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3 | 20 18 65 62 61 | 3
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4 | 22 21 60 59 | 4
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5 | 23 24 58 57 | 5
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6 | 25 26 56 55 | 6
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7 | 27 28 53 54 | 7
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8 | 29 30 50 52 | 8
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9 | 31 32 34 37 40 42 44 46 48 51 | 9
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10 | 33 35 36 38 39 41 43 45 47 49 | 10
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+----------------------------------------+
K J H G F E D C B A
Pad to Pin Layout -- TOP View
CAUTION: the pad-to-pin layout varies for different 65 pin products,
even those from a single vendor. For our purposes, equivalent parts
have the same pin grid, the same pad to pin layout, and the same pad
to cavity (substrate) connection. Be sure to use this diagram for
MOSIS-supplied parts unless or until instructed otherwise.
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