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MOSIS Ceramic Packaging Connections and Information
PGA84
MOSIS offers as a standard part an 84 pin grid array package. This
package is available in two cavity sizes. The first is Kyocera
KD-P90164 or equivalent with a 0.470" cavity (topside). The second is
Kyocera KD-P90226 or equivalent with a 0.350" cavity (also topside).
Both are 1.100" square packages and have the same bonding finger to
pin mapping. The pins of these packages are arranged on an 11 x 11 pin
grid at 0.1" centers. There are two full rows of pins around the
outside (72 pins) and three more pins in the center of each side (12
pins). The following diagram depicts the bonding pad to pin
connectivity as viewed from the top of the package (or the top of the
socket into which the package is plugged), with the index at the upper
right corner. (This view corresponds to the MOSIS standard frame
layout that has pin #1 in the upper right hand corner and proceeds
counterclockwise around the die.) The columns of the grid are labelled
alphabetically and the rows numerically.
X
/
L K J H G F E D C B A /
+--------------------------------------------+
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1 | 21 19 18 16 13 12 9 6 4 3 84 | 1
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2 | 24 22 20 17 14 7 8 5 2 1 82 | 2
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3 | 25 23 15 11 10 83 81 | 3
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4 | 27 26 80 79 | 4
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5 | 30 29 31 75 77 76 | 5
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6 | 33 28 32 74 73 78 | 6
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7 | 34 35 36 70 71 72 | 7
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8 | 37 38 68 69 | 8
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9 | 39 41 49 53 54 65 67 | 9
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10 | 40 43 44 47 50 52 56 59 62 64 66 | 10
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11 | 42 45 46 48 51 57 55 58 60 61 63 | 11
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+--------------------------------------------+
L K J H G F E D C B A
Pad to Pin Layout -- TOP View
CAUTION: the pad-to-pin layout varies for different 84 pin products,
even those from a single vendor. For our purposes, equivalent parts
have the same pin grid, the same pad to pin layout, and the same pad
to cavity (substrate) connection. Be sure to use this diagram for
MOSIS-supplied parts unless or until instructed otherwise.
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