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AMI Semiconductor
0.50 Micron

C5 Process



1. Process Family Description

This non-silicided CMOS process has 3 metal layers and 2 poly layers, and a high resistance layer. Stacked contacts are supported. The process is for 5 volt applications. MOSIS orders epi wafers for this process. For further information, see the AMIS Mixed Signal Foundry Services web page.

C5N Process

PiP (poly2 over poly) capacitors (950 aF/µm²) and the HRP (High Resistance) option are available on multiproject runs.

C5F Process

The C5F process offers the above layers of C5N plus Thick_Gate, N_Minus_Implant (Npblk), and P_Minus_Implant (Ppblk).

2. Design Rules

This process support the following design rules

Design Rules Lambda
(micro- meter)
Feature Size
(micro- meter)
Available From
AMI_C5F/N Rules n/a 0.60 AMIS (See Section 3)

SCMOS_SUBM 0.30 0.60 MOSIS in HTML

SCMOS 0.35 0.60
(after sizing)
MOSIS in HTML

Review the CMP and antenna guidelines which apply to both sets of design rules.


MOSIS Technology Codes

See Technology Codes for AMIS C5F/N Process.

Important note about pads

The bonding pads on designs submitted to these runs should have metal2 (and via2) under the metal3. If these guidelines are not followed, metal lifting problems can occur.

3. AMIS Design Rules, Process Specifications, and SPICE Parameters

AMIS has sub-licensed MOSIS to distribute this information to customers who do not have a MyAMIS account. To obtain any of these items you must have an account with MOSIS, submit the on-line AMIS Access Request, then sign both the Confidentiality Agreement (CDA) and Design Kit License Agreement (DKLA).

4. Parametric Test Results and SPICE Model Parameters

See Test Results for AMIS C5F/N runs.

5. Reticle/Wafer Size, Steps, Turnaround Time, Wafer and Die Thickness



AMIS C5 Process
Wafer Size
(inches)
Reticle Size (mili- meters, approx.) Reticle Copies Stepped on Wafer (approx.) Turn- around Time (weeks, approx.) Die Thickness
(+/- .5 mil)
Wafer Thickness
Mils Micro- meters Mils Micro- meters
8 21 x 21 55 10 - 12 10 250 30 760



Related Links
  • MOSIS-Supported AMIS Processes
  • AMIS Technology Codes & Layer Maps
  • AMIS Document Access



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