The New Project form allows you to request a design number for a new project you intend to fabricate through MOSIS. The design number is a unique number issued by MOSIS used to identify the project in all subsequent communications with MOSIS. For example, if you want to request fabrication of your design, you need to know the design number.

The parameters in the Optional section are not required to create a new project. If they are applicable to your project, you can specify them in this form or later in the Update or Fabricate forms.

CUSTOMER-ACCOUNT-NUMBER

The customer account number is an integer that identifies the previously established MOSIS account to be charged for your project. It is the leading numeric portion of your customer account string. For example, the account number for account string "6789-COM-IND/MY_ORGANIZATION" is 6789. If you don't have a MOSIS customer account, see Types of Accounts for information about setting up a MOSIS account and submitting a purchase order.

CUSTOMER-ACCOUNT-PASSWORD

The password to your MOSIS customer account. This password is assigned by MOSIS when your account is established.

DESIGN-NAME

A short name you choose to identify your design. This name might indicate what your design is (for example, "ADDER"). You may want to include a version number if you are submitting a design similar to previous designs. Although it is not required, you should normally choose distinct names for different projects to avoid confusion.

DESIGN-PASSWORD

A password you choose for your design. Both the MOSIS-assigned design number and the user-selected design password are required to make any changes to your project (request fabrication, cancel fabrication, get project status, etc).

EMAIL-ADDRESS

A list of one or more e-mail addresses, separated by commas. All replies to requests for this project are sent to the addresses in this list. The "in fab" and "project shipped" notification messages are also sent to this list. If you enter your address incorrectly, you won't receive any e-mail confirmations of transactions for this project. Note that for requests submitted via the web, an e-mail confirmation is only sent if the request is processed successfully.

PHONE-NUMBER

The telephone and FAX numbers of the person who designed the project. MOSIS customer support may need to use these numbers to communicate with the designer.

RUN-TYPE

The type of run for which project is being submitted. Most users should choose the default, which is a scheduled multi-project run shared with other customers. A dedicated single customer run is an "on demand" run which is only for customers who want an entire run to themselves, to be closed on the date they choose. Dedicated run pricing must be negotiated with MOSIS Customer Support. A Trusted Foundry run is sponsored by DARPA and is only available to projects authorized by DARPA.

RUN-DATE-REQUESTED

Requested run closing date for your design, in format DD-MON-YYYY (e.g., 11-JAN-2010). MOSIS uses this date for planning purposes, and requires that you specify it for MPW submissions. Please see the fabrication schedule for MPW run dates and enter the date of the run that you are targetting.

EXPORT-CONTROL

The type of export control to which project is subject. A value of "Standard" means no export control, or export controls as dictated by responses to the ECCN Questionnaire. A value of "ITAR" means the project is subject to ITAR regulations.

IP-INCLUDED

Some designs include intellectual property (IP) licensed from another party (for example, ARM). If your design includes licensed IP, you must choose "ARM" if the IP is licensed from ARM or "Other" if the IP is licensed from some other vendor. This will allow MOSIS to help you meet your contractual obligations with respect to that property. For ARM, please fill out the appropriate ARM tapeout form and fax to +310.823.5624, attention MOSIS Support.

FILL-AUTHORIZED

This parameter is used to authorize ("Yes") or forbid ("No") the adding of fill to this project, for those processes where MOSIS is capable of adding fill to the layout to raise the layer density. You should select "Yes" only if you have not designed your project to meet the minimum density requirements needed to facilitate Chemical Mechanical Polishing (CMP). For those processes where MOSIS cannot add fill to the layout, this parameter is "not applicable"; this includes those processes where the foundry will always add fill in accordance with its rules.

Note that there may not be enough open area in your project to add the required amount of fill, so authorizing MOSIS to add fill does not guarantee that density requirements will be met. Also note that adding fill may change the characteristics of your circuit. For more information, see Fill Requirements for Chemical Mechanical Polishing.

TECHNOLOGY-CODE

A code indicating which design rules you used for your project. A list of the possible technology codes and lambda values is available on the Technology Codes and Layer Maps page.

LAMBDA

Value of lambda for the design rules you used for your project. Lambda must be provided for all scalable technologies. For non-scalable design rules, use the default value of "None". For information on the possible Technology Code / Lambda combinations, see the TECHNOLOGY-CODE field. If the correct value of lambda is not in the pull-down list, please contact MOSIS customer support.

FOUNDRY

The particular wafer fabricator where you want your design fabricated. The default value of "Any" allows your design to be fabricated on the next fabrication run with a vendor that supports the design rule set you used. Choose one of the items in the pull-down list to restrict fabrication to one particular vendor. It is not necessary to use this parameter when specifying a foundry-specific technology, e.g., HP_AMOS14TB, since a foundry is already implied; however, you may want to use this parameter for vendor-independent design technologies.

SUBSTRATE-OPTIONS

The type of substrate your design requires. Applies only to TSMC 0.18 and 0.25 micron processes; for other processes MOSIS offers no options, so NONE should be selected. Requests for an epi or non-epi substrate on multiproject wafer runs will be honored at no charge only if the product mix requires a wafer lot of the requested substrate type. Currently, all Mixed Mode (MM) MPW lots are non-epi; if your LO design must be fabricated on epi or non-epi wafers, contact support@mosis.com for a price quotation. For more information, see Epitaxial Substrates in IC Designs.

TOP-METAL-OPTIONS

For TSMC 0.25 and TSMC 0.18 processes, two thicknesses of the top metal are offered: standard and thick (intended for inductors). Note that use of the thicker top metal requires adherance to the special thick top metal design rules, which have much larger minimum width and spacing than does the standard top metal.

BONDING-OPTIONS

For IBM processes, three bonding types are available. Traditional wirebonding or C4 (Controlled Collapse Chip Connect) bump bonding, using either a leaded solder or an unleaded solder for the bumps. The passivation layer that is used in your layout must be compatible with the bonding choice made here.

BUMPING-OPTIONS

applies only to IBM processes that have selected a C4 bonding option. These are the three standard bump sizes (diameter and height) that IBM provides; for each size, there is a minimum bump pitch that your layout must honor.

INTENDED-DISPOSITION

What you ultimately plan to do with this design. Choose Production for all production stages, such as product engineering, manufacture, integration, etc. Choose Development for all stages prior to serial production. Choose Research if this design is a research project for which you intend to publish results of the design/software in publicly available resources.

DESIGN-KIT-VERSION

Version of design kit you used to design your project. Required for IBM design technologies. Leave blank for other technologies.

DESIGN-SIZE-X, DESIGN-SIZE-Y

The X and Y dimensions of your design, in microns. The values do not have to be exact, but if they are not within 10% of the values we compute during manufacturability review your project will fail design check. This requirement ensures that you and MOSIS agree on how big your design is and ensures that most scaling errors are detected.

PAD-COUNT

The number of bonding pads in your design. During manufacturability review, MOSIS counts the number of bonding pads and verifies that the number we counted is greater than or equal to the number you specified.

PO-NUMBER

For commercial account ('COM' account) customers, and MEP account customers who are purchasing packaging; specifies the purchase order number authorizing the fabrication of your project. The number should be entered exactly as it appears on the physical P.O. (this includes any non-alphanumeric characters such as hyphens).

QUOTE-ID

If MOSIS has given you a quote ID or an MEP proposal ID, please enter it here. Otherwise, you should leave this field blank.

Project Packaging Section

The Project Packaging section must be filled in at least once before MOSIS will run a manufacturability review. Changes are not incremental; if you fill in anything in this section, a new packaging order is generated and it completely replaces any previous packaging order.

If you want any packaged parts, you must fill in the PACKAGE-NAME and BONDING-DIAGRAM-SUPPLIER fields.

QUANTITY-PACKAGED

The number of parts to be delivered packaged in the package named in PACKAGE-NAME. If you want all parts packaged, enter the word "ALL". If you leave this field blank but enter a number in the QUANTITY-UNPACKAGED field, any remaining parts from your explicit or implicit QUANTITY-ORDERED will be packaged. If you want to constrain the size of your die to fit in a package, but don't want MOSIS to package any of the parts, enter a zero and make sure you provide the name of a Package Available Through MOSIS.

QUANTITY-UNPACKAGED

The number of parts to be delivered unpackaged (as loose die). If you want all parts unpackaged, enter the word "ALL". If you leave this field blank, but enter a number for the QUANTITY-PACKAGED, any remaining parts from your explicit or implicit QUANTITY-ORDERED will be delivered unpackaged.

PACKAGE-NAME

The name of the package in which your design is to be packaged. For names of available packages, see Packages Available Through MOSIS. If you want MOSIS to select a package for you based on your design size and pad count, enter the word "DEFAULT". If you don't want any of your parts packaged or constrained in size by a package, leave this field blank. If you want to receive unpackaged parts, but intend to package the parts yourself in a package known to MOSIS, enter the package name in this field and a zero in the QUANTITY-PACKAGED field. If you want your parts packaged in two or more different packages, you must request it in SPECIAL-HANDLING. Please note that there are additional charges for multiple packages.

ROTATION-IN-PACKAGE

The desired orientation of your die in the package cavity. For each package, MOSIS defines a fixed orientation of the package cavity (which is the one you see in our bonding diagrams). The values are None (die in the drawn orientation), 90 degrees CW (die rotated 90 degrees clockwise, or to the right), 180 degrees (die upside down) and 270 degrees CW (die rotated 270 degrees clock-wise, or 90 degrees counter-clockwise).

BONDING-DIAGRAM-SUPPLIER

The source of the bonding diagram used to package your project. Select "MOSIS" if you want MOSIS to attempt to generate a bonding diagram automatically. Select "Customer" if you will supply a bonding diagram. Customer-supplied bonding diagrams should be faxed to MOSIS Packaging Manager at 310.823.5624. Leave this field as "None" if you are not ordering any packaged parts. Please note that MOSIS can only attempt automatic bonding diagram generation for Ceramic Packages and for OCP Plastic Packages Available From MOSIS; for encapsulated plastic packages, you must select "Customer" and supply a bonding diagram.

DOWNBOND-LOCATIONS

The sides of the package cavity on which substrate downbonds are being used. MOSIS-generated bonding has no provision for downbonding, so only the value NONE is applicable. This parameter is useful only for customer-supplied bonding diagrams (which will explicitly show the downbonds), and then it is used only to verify the fit of the design into the package cavity.

[End Project Packaging Section]

QUANTITY-ORDERED (optional)

The total number of parts you want to order, including both packaged and unpackaged parts. You do not need to specify the number of parts unless you want to order more than the minimum quantity. Arbitrary quantities of parts are not allowed. Please see the Prototype Lot Quantities page for acceptable quantity values.

DESCRIPTION (optional)

A description of your design. This description is used only to help MOSIS understand what kinds of projects customers are submitting. Do not include any special processing, fabrication or bonding instructions here - use SPECIAL-HANDLING for such instructions.

ROUTING-LABEL (optional)

The "Deliver-to" address within your organization. Upon completion of the fabrication process, parts are placed in static-dissipative carriers and sealed in individual envelopes, which are then placed in boxes and shipped to our customers. Parts that were submitted for fabrication under a commercial account are shipped to the address specified on the purchase order. Parts that were submitted under a research or education account are sent to the shipping address associated with the account in our database. The text of the optional ROUTING-LABEL parameter is used to generate a label that will be placed on the envelope inside the shipping box. The label is not used for shipping, but for internal routing from the destination point.

SPECIAL-HANDLING (optional)

Special size, bonding and shipping requests not already requested. Use only to provide instructions not covered by other parameters.