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Update Form

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Use this form to update or add information for a previously created project. You must know the project's Design Number and Design Password. For more detailed information, see the Update Documentation.

You cannot use this form to submit a revised version of your layout. First, if you have previously sent layout for this design, send a Cancel Fabrication request. Then send your revised layout with a new Fabricate request form.



Required Parameters
Design Number: (5-digit or 6-digit design number assigned to project by MOSIS)
Design Password: (Password you chose at project creation)
Add or Update Order Information
Quantity Ordered:
PO Number: (For commercial accounts and MEP packaging)
Quote Id: (For assigned quote or MEP proposal ID only)
Replace Project Packaging
  Fill out this section only if you have not specified packaging parameters yet or if you want to change the previously specified parameters. A new bonding diagram will be generated (if applicable) if there are any non-blank fields in this section. See Project Packaging for detailed help for this section.  
  Quantity Package Name Rotation in Package Bonding Diagram Supplier Downbond Locations
Quantity Packaged:
Quantity Unpackaged: N/A N/A N/A N/A
 
Add or Update Fabrication Information
Run Type: (Select one)
Run Date Requested: (Example: 27-sep-2005)
IP Included: (Vendor of licensed intellectual property in design (e.g., ARM). Select all that apply.)
Unchanged       None       Aragio       ARM       Virage
Other   (Specify in Special Handling)
Fill Authorized: (Only applicable to TSMC and On Semi)
Technology Code: (See Technology Codes and Layer Maps for a list)
Lambda: (Select one)
Foundry: (Select one)
Substrate Options: (Only for those processes that offer a substrate choice)
Top Metal Options: (Only for TSMC 0.18 and 0.25 processes)
Bonding Options: (Only for IBM processes)
Bumping Options: (Only for IBM C4 (leaded or lead-free) processes)
Intended Disposition: (Required by export control regulations)
Design Kit Version: (For IBM design technologies only)
Add or Update Layout Information
Layout Format: (Select one)
Top Structure:
Design Size X: (In microns)
Design Size Y: (In microns)
Pad Count:
Add or Update Address Information
E-mail Address: (For confirmations from MOSIS)
Phone Number:
Routing Label:
("Deliver-to"
address WITHIN
your company)
Add or Update Miscellaneous Information
Design Name: (Name you choose for this project)
Description:
(Paragraph
describing
project)
Special Handling:
(Special packaging,
shipping or die
size requirements)

Last Updated: September 23, 2005



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