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MOSIS News
MOSIS, CMP, and CMC Partner to Introduce a 3D-IC Process
MOSIS, CMP, and CMC are partnering to offer a 3D-IC Multi-Project Wafer
(MPW) service based on Tezzaron Semiconductor's SuperContact
technology and GLOBALFOUNDRIES' 130 nm CMOS process. [June 22, 2010]
[See also article in EE Times]
Right first time design needs a radical rethink
Smaller IC feature sizes bring additional problems that are difficult
to predict, so why not plan for a re-spin and take advantage of
multi-project wafer (MPW) runs? [October 23, 2009]
MOSIS: An Old Idea for Foundry Access Suddenly Sounds Pretty Forward-Looking
FROM THE EDN ARTICLE: "MOSIS, in case you aren't familiar with the
organization, is a source of back-end IC production services, from
multi-project wafers (MPWs) to small production runs. But it's also
much more. The company started out in 1981 providing spots on MPWs for
organizations doing research, test chips, samples, or limited
production. In those days real men still had fabs, so the customers
tended to be research programs, universities, or military
contractors. But much has changed in nearly 30 years."
[Read Full Article]
[August 17, 2009]
MOSIS Mixing it Right for Mixed Signal
While increased choice can only be good, designers need to take care
selecting the best process and technology for a specific
application. [July 21, 2009]
[No Respins] Yes, You Can Just Do It
The MOSIS Multi-project-wafer (MPW) services is an affordable way to
get your design fabricated. [February/March 2007]
MOSIS MPW Can Get Chips To Market Quicker
Customers who use MOSIS MPW services save overhead costs and reduce
the time it takes to get their chips to market.
[February 5, 2007]
MOSIS And Sempac Announce Low-Cost Alternative To Ceramic Packages
Customers who use the MOSIS multi-project wafer (MPW) service will be
able to access QFN/MLP, QFP and SOIC/SSP packages from Sempac's
Open-Pak product line.
[September 15, 2006]
MOSIS Reduces The Fabrication Cost To Non-US Customers
Fabrication costs to non-US companies are now the same as for US
companies, plus a small export adder ($500 per project). Packaging
costs are unchanged.
[September 11, 2006]
GSA (was FSA) Spotlight On MOSIS
MOSIS has been a member of GSA (was FSA) since 1997. [August 25, 2006]
MOSIS Makes Chip Fabrication Affordable
This year marks the 25th anniversary of a groundbreaking program that
has introduced tens of thousands of engineering students to the real
world of integrated circuit design. [December 6, 2005]
MOSIS Fabricates First Chip Designed by Students of Massey University
For the first time, an undergraduate class from Massey University (New
Zealand) designed a silicon chip from scratch and fabricated it
through MOSIS. [October 10, 2005]
austriamicrosystems Partners with MOSIS to Serve Foundry Customers
MOSIS offers austriamicrosystems' complete foundry
service portfolio and its high performance CMOS, SiGe-BiCMOS, and
High-Voltage CMOS processes. [October 5, 2005]
AMI, MOSIS Ink Multi-Project Wafer Deal
AMI Semiconductor Inc. renewed its partnership with
MOSIS for multi-project wafers. [August 29. 2005]
Bomb Sniffers Sharpen Nose
A modified capacitive transimpedance amplifier fabricated through
MOSIS promises to increase the sensitivity of airport explosives
detectors one thousandfold, making it possible for handheld devices to
sniff the air around baggage and passengers without delaying
departures. [April 04, 2005]
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