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MOSIS Quality Control
MASK MAKING:
Mask vendors are required to perform an automated inspection prior to
shipment. For full wafer lithography masks, vendors conduct a
die-to-die defect inspection over a sample region of each mask to meet
MOSIS' mask defect requirements. For direct-step reticles, vendors
perform a full inspection and repair of the reticle.
WAFERS:
Process parameters are measured on each lot of wafers by the
fabricator's process control monitors, and a set of MOSIS' parametric
test structures and yield monitors. Final acceptance of individual
wafers is based on this data. Information from these measurements is
maintained in statistical quality control charts to help select
vendors and to continuously monitor vendor quality. Summary reports of
measured data are published for each wafer lot. Defect density
information is available upon request.
PACKAGING:
MOSIS packagers must follow strict static electricity control
procedures and must meet industry visual inspection criteria. A visual
inspection is performed before and after die assembly. MOSIS also
performs a visual inspection for bond quality and project identity
verification. See
Packaging Quality Control for further information.
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Related Links
Fabrication Schedule
Customer Support
MOSIS Products
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