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IBM Semiconductor
0.13 Micron
8WL SiGe BiCMOS Process
Information vital to preparing and submitting a design for fabrication
in this process has been posted to the MOSIS
Secure Document Server.
All users must read the checking procedures and density
requirements described in this document.
If your design will be used for production, i.e. non-MPW, please read
the IBM policy described in
"Checking and
Error Disposition Strategy for IBM Designs."
Process Description
MOSIS is offering access to the IBM 0.13 micron SiGe BiCMOS 8WL
technology for prototype and low volume fabrication.
C4 (IBM's flip chip bumping) is subject to availability at additional
cost. Advance notice required: contact
support@mosis.com.
This BiCMOS SiGe process offers up to 9 metal layers. MOSIS is
supporting 5 metal layers (M1, M2, MQ, OL, LD) for MPW runs. This
process supports MiM capacitor (4.1 fF/µm²). The
thick-copper OL metal layer of metal can be used to make inductors.
Supply voltages are 1.2 V core and 2.5/3.3 V I/O. For more
information, see the
SiGe
process comparison.
8WL Supported Options
Please refer to the List of
8WL Supported Options page for the options available by default on
MOSIS MPW runs in this technology.
Other configurations are available for dedicated runs, or on MPW runs
by prior arrangement. Please contact
MOSIS support for additional details, e.g. costs.
Design Considerations
To insure that submitted data is on a 10 nm grid, please stream-out at
1 DBU = 10 nm (Cadence 0.010, not 0.001).
MOSIS does not fill for IBM processes. Designs for IBM runs must meet
the IBM fill requirements when submitted.
IBM Design Rules, Process Specifications, SPICE Parameters, and
Cell Libraries
IBM has sub-licensed MOSIS to distribute this information to
customers
who have signed both the MOSIS customer agreement and the IBM Design
Kit License Agreement.
The CAD tool support files, DRC and LVS decks, simulation files, cell
libraries, and files listed on the
IBM SiGe Design
Kits page are the only kits and files available.
Design rules supported by this technology
Only the IBM design rules will be supported for this
technology.
MOSIS Technology Codes
The technology code for the 8WL process is IBM_8WL.
Parametric Test Results and SPICE Model Parameters
See
Test Results for IBM 0.13 micron runs.
Reticle/Wafer Size, Steps, Die and Wafer Thickness
IBM SiGe BiCMOS
0.13 Micron
8WL Process
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Wafer Size
(inches)
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Reticle Size (milli- meters, approx.)
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Reticle Copies Stepped on Wafer (approx.)
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Turn- around Time*
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Die Thickness
(+/- .5 mil)
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Bumped Die Thickness **
(+/- .5 mil)
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Wafer Thickness
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Mils
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Micro- meters
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Mils
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Micro- meters
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Mils
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Micro- meters
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8
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18 x 20
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60
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73
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10
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250
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10
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250
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30
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760
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* Calendar days from release to manufacturing. Does not include
dicing/packaging/backlapping (for planning purposes only).
** Die thickness only. Does not include height of the bumps.
To order a special bumped die thickness, describe
your requirements in the SPECIAL-HANDLING parameter of your New
Project, Fabrication, or Update Request.
IBM Microelectronics
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Related Links
MOSIS-Supported IBM Processes
IBM Technology
Codes & Layer Maps
IBM Document Access
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