DIP28
MOSIS Ceramic Packaging Connections and Information
MOSIS offers, as a standard part, a 28 lead dual-inline package (DIP).
This package is Kyocera KD-77385 or equivalent with a 0.310" cavity
(topside). The following diagram depicts the bonding pad to pin
connectivity as viewed from the top of the package (or the top of the
socket into which the package is plugged), with the index at the upper
right corner.
14 1 +----------------------------------------+ | | | | | | | ---| | | | | ---| | | | | | | +----------------------------------------+ 15 28 Top View