LCC84L
MOSIS Ceramic Packaging Connections and Information
MOSIS offers as a standard part an 84 leadless chip carrier package.
This package is Kyocera PB-02689 or equivalent with a 0.470" cavity
(topside) and is 1.150" square. The following diagram depicts the
bonding pad to pin connectivity as viewed from the top of the package
(or the top of the socket into which the package is plugged), with the
index on the middle of the right side.
32 12 +----------------------------------------+ 33 | | 11 | | | | | | | | | | | | | | | | | | | | 1 | | 84 | | | | | | | | | | | | | | | | 53 | | 75 +----------------------------------------+ 54 74 Top View