PGA108
MOSIS Ceramic Packaging Connections and Information
MOSIS offers as a standard part an 108 pin grid array package. This
package is available in two cavity sizes. The first is Kyocera
KD-P87938-A or equivalent with a 0.450" cavity (topside). The second
is Kyocera KD-P89113 or equivalent with a 0.350" cavity (also
topside). Both are 1.200" square packages and have the same bonding
finger to pin mapping. The pins of these packages are arranged on an
12 x 12 pin grid at 0.1" centers. There are three full rows of pins
around the outside. The following diagram depicts the bonding pad to
pin connectivity as viewed from the top of the package (or the top of
the socket into which the package is plugged), with the index at the
upper right corner. (This view corresponds to the MOSIS layout that
has pin #1 in the upper right hand corner and proceeds
counterclockwise around the die.) The columns of the grid are
labelled alphabetically and the rows numerically.
A B C D E F G H J K L M +------------------------------------------------+ | | 12 | 28 27 26 23 20 17 14 11 8 5 3 1 | 12 | | 11 | 30 29 25 22 19 16 13 10 7 4 2 108 | 11 | | 10 | 32 31 24 21 18 15 12 9 6 105 106 107 | 10 | | 9 | 35 34 33 102 103 104 | 9 | | 8 | 38 37 36 99 100 101 | 8 | | 7 | 41 40 39 96 97 98 | 7 | | 6 | 44 43 42 93 94 95 | 6 | | 5 | 47 46 45 90 91 92 | 5 | | 4 | 50 49 48 87 88 89 | 4 | | 3 | 53 52 51 60 63 66 69 72 75 78 85 86 | 3 | | 2 | 54 56 58 61 64 67 70 73 76 79 83 84 | 2 | | 1 | 55 57 59 62 65 68 71 74 77 80 81 82 | 1 +------------------------------------------------+ A B C D E F G H J K L M Pad to Pin Layout -- TOP View