Wafer and Die Thickness
Wafer and Die Thickness
When we order wafers for fabrication, they return with a default wafer
thickness set by that foundry.
The wafers are then sent to a packaging vendor for dicing and
assembly. The packaging vendor backgrinds each wafer to die thickness
prior to dicing the wafer. The die thickness has to satisfy the
packaging requirements of all the customers on a multi-project run.
Contact MOSIS support if
these thicknesses don't meet your requirements.
Customers on dedicated runs can dictate a thickness up to that
provided by the vendor.