Organizations offering products and services to the VLSI design community can ask to be added to this or the design-services-specific list. Send your request, a description of your company, and contact information to support@mosis.com.
Evergreen Semiconductor Materials, Inc
Spectrum Semiconductor Materials, Inc.
I2A Technologies (formerly IPAC)
Agile Enterprises Inc (formerly Mulvin & Company)
In addition to the vendors below, flip chip bumping is also available for IBM and TSMC processes via the foundry. Contact support@mosis.com.
Nano Integrated Solutions, Inc.
Please note MOSIS does not necessarily endorse the products and services listed on this page.