Third Party Services
Organizations offering products and services to the VLSI design community can ask to be added to this or the design-services-specific list. Send your request, a description of your company, and contact information to MOSIS Support System.
IC Assembly Services
Tektronix Component Solutions, Inc.
Ceramic Packages
Evergreen Semiconductor Materials, Inc
Spectrum Semiconductor Materials, Inc.
Tektronix Component Solutions, Inc.
Plastic Packages (Fully Encapsulated)
I2A Technologies (formerly IPAC)
Plastic Packages (Open Cavity)
Tektronix Component Solutions, Inc.
Test Sockets
Agile Enterprises Inc (formerly Mulvin & Company)
Flip Chip Bumping
In addition to the vendors below, flip chip bumping is also available for IBM and TSMC processes via the foundry. Contact MOSIS Support System.
Die and wafer carriers
Testing Services
Nano Integrated Solutions, Inc.
Tektronix Component Solutions, Inc.
Test Fixtures
Design Services
Please note MOSIS does not necessarily endorse the products and services listed on this page.