Prototype Lot Quantities and Sizes

Number of die in a prototype lot and minimum size for cost calculation, by process.

Vendor	Process	Feature Size	Minimum Size¹ (mm²)	Number of Parts In A Lot
ON Semi (was AMI Semi)	C5 (CMOS)	0.5 µm	5	40
	I2T100 (CMOS)	0.7 µm	10	20
	I2T30 (CMOS)	0.7 µm	8	20
	I3T80 (CMOS)	0.35 µm	10	20
	I3T50 (CMOS)
	I3T25 (CMOS)

AMS	C35 (CMOS)	0.35 µm	4	25
	H35 (HV CMOS)
	S35 (SiGe BiCMOS)

IBM	5HPE (SiGe BiCMOS)	0.35 µm	25	40
	5PAe (SiGe BiCMOS)	0.35 µm	25	40
	7RF (Mixed Mode)	0.18 µm	25	40
	7WL (SiGe BiCMOS)	0.18 µm	25	40
	8RF-DM/LM	0.13 µm	25	40
	8HP (SiGe BiCMOS)
	8WL (SiGe BiCMOS)

TSMC	CL035, CM035 (CMOS)	0.35 µm	25	40
	CL025 (Logic)	0.25 µm	25	40
	CM025 (Mixed Mode)	0.25 µm	25	40
	CL018 (Logic)	0.18 µm	25	40
	CM018 (Mixed Mode)	0.18 µm	25	40
	CL013G (Logic)	0.13 µm	25	40
	CR013G (Mixed Mode)	0.13 µm	25	40

¹ Minimum die size is for cost calculation. Submitted die can be smaller and more die may be available for close to the same minimum order cost.