MOSIS MPW Fabrication Schedules

MOSIS offers multiproject wafer (MPW) runs for the following IC fabricators. Designers need to plan design activities to meet the schedule constraints. To be considered ontime for an MPW run, layout and paperwork are due to MOSIS by 1 PM PT (Pacific/California Time) on the date listed.

IBM Fabrication Schedule

The technologies included in the IBM MPW fabrication schedule range from 32 nanometer to 0.18 µm in CMOS, and from 0.13 µm to 0.35 µm in SiGe BiCMOS. Additional processes are available on taxi runs.

TSMC Fabrication Schedule

Multiproject wafer (MPW) runs available through TSMC include a range of feature sizes from 40 nanometer to 0.35 µm, many available in low power, low voltage, and high voltage.

ON Semiconductor Fabrication Schedule

The ON Semi fabrication schedule includes MPW runs in the following processes: 0.7 µm high voltage CMOS, 0.5 µm CMOS, and 0.35 µm high voltage CMOS.

austriamicrosystems (AMS) Fabrication Schedule

The AMS fabrication schedule offered by MOSIS include 0.35 µm CMOS, high voltage CMOS, and SiGe BiCMOS processes.

Globalfoundries Fabrication Schedule

The processes offered by MOSIS through Globalfoundries range from 65 nanometer to 0.18 µm.

Tezzaron Fabrication Schedule

MOSIS offers access to Tezzaron two-tier 3DIC multiproject wafer (MPW) runs.

Peregrine Fabrication Schedule

The Peregrine fabrication schedule offered by MOSIS include both 0.50 µm SOS process (FC and FA), and the two versions of the 0.25 µm SOS process (GA and GC).

Dedicated (COT) runs through MOSIS are also available. Dedicated runs can be scheduled to start at any time. For more information about participating on these or other runs through MOSIS, please contact support@mosis.com.

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Fabrication Schedule

FEB 13  GF GF_018  IBM 6WL  IBM 7RF  ON-SEMI I3T50 FEB 21  AMS C35B4M3  AMS S35D4  GF GF_013  IBM 8WL  TSMC 0.35 µm  TSMC 40 nm  TSMC 45 nm  TSMC 90 nm FEB 27  GF GF_035  TSMC 0.18 µm  TSMC 65 nm MAR 05  TSMC 0.18 µm  TSMC 0.25 µm  TSMC 90 nm MAR 12  GF GF_65LPE  IBM 5PAE  IBM 7RFSOI  TSMC 0.13 µm  TSMC 0.18 µm  TSMC 40 nm  TSMC 45 nm  TSMC 65 nm MAR 19  IBM 7WL MAR 21  TSMC 65 nm MAR 26  IBM 5HPE  IBM 8HP  ON-SEMI C5F/C5N  ON-SEMI I2T100  ON-SEMI I2T30  TSMC 0.18 µm  TSMC 65 nm APR 02  TEZZARON TEZZ 3DIC  TSMC 0.18 µm  TSMC 0.25 µm  TSMC 90 nm