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Number of die in a prototype lot and minimum size for cost calculation, by process.
Prototype Lot Quantities and Sizes
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Vendor
|
Process
|
Feature Size
|
Minimum Size¹
(mm²)
|
Number of Parts
In A Lot
|
ON Semi
(was AMI Semi)
|
C5 (CMOS)
|
0.5 µm
|
5
|
40
|
|
I2T100 (CMOS)
|
0.7 µm
|
10
|
20
|
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I2T30 (CMOS)
|
8
|
|
I3T80
(CMOS)
|
0.35 µm
|
10
|
20
|
|
I3T50
(CMOS)
|
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I3T25
(CMOS)
|
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AMS
|
C35 (CMOS)
|
0.35 µm
|
10
|
40
|
|
H35
(HV CMOS)
|
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S35
(SiGe BiCMOS)
|
|
IBM
|
5HPE
(SiGe BiCMOS)
|
0.35 µm
|
25
|
40
|
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5PAe
(SiGe BiCMOS)
|
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7RF (Mixed Mode)
|
0.18 µm
|
25
|
40
|
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7WL
(SiGe BiCMOS)
|
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8RF-DM/LM
|
0.13 µm
|
25
|
40
|
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8HP (SiGe BiCMOS)
|
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8WL (SiGe BiCMOS)
|
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9LP/RF
|
90 nm
|
16
|
40
|
|
10SF (Logic)
|
65 nm
|
12
|
40
|
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10LP/RFe
|
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TSMC
|
CL035, CM035
(CMOS)
|
0.35 µm
|
25
|
40
|
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CL025 (Logic)
|
0.25 µm
|
25
|
40
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CM025 (Mixed Mode)
|
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CL018 (Logic)
|
0.18 µm
|
25
|
40
|
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CM018 (Mixed Mode)
|
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CL013G (Logic)
|
0.13 µm
|
25
|
40
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CR013G (Mixed Mode)
|
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¹ Minimum die size is for cost calculation. Submitted die can be
smaller and more die may be available for close to the same minimum
order cost.
Related Links
Fabrication Schedule
Customer Support
MOSIS Products
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