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TSMC Processes Available Through MOSIS

MOSIS has compiled the following chart comparing various features to help you better select which TSMC process is most appropriate to your applicaiton.

Feature Size Process Description
TSMC 0.13 CL013G Standard logic, RPO
CR013G (CM013) Mixed-mode/RF, RPO, MiM
CL013LP Low-power logic, RPO
CL013LV Low-voltage logic, RPO

TSMC 0.18 CL018 Standard logic, RPO
CR018 (CM018) Mixed-mode/RF, RPO, MiM
CL018LP Low-power logic, RPO
CL018LV Low-voltage logic, RPO
CL018HV High-voltage, RPO

TSMC 0.25 CL025 Standard logic, RPO
CR025 (CM025) Mixed-mode/RF, RPO, MiM

TSMC 0.35 CL035 Standard logic, 5.0 V ESD, RPO
CM035 Mixed-mode/RF, 5.0 V ESD, PiP, 2-poly
CL035HV High-voltage, RPO


These processes use non-epitaxial wafers. Epitaxial wafers are available at an additional cost. Specify "epitaxial wafers" in the "Options" section of the Request for Custom Quote form for pricing. To order epitaxial wafers, submit the Request for Custom Quote and select the epitaxial fabrication option from either the New Project, Fabricate, or Update form.

For more information about the TSMC fabrication processes available through MOSIS, please contact support@mosis.com.



Related Links
  • TSMC Document Access
  • TSMC Design Kits (TSMC Processes)
  • TSMC Fabrication Schedule



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