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Microelectromechanical Devices
(MEMS)
MOSIS offers access to
PolyMUMPS,
SOIMUMPS, and
MetalMUMPS
MEMS technology from MEMSCAP.
MOSIS is committed to providing access to CMOS-Compatible MEMS
Technology at some point in the future. This future service will
include a post CMOS process etch that will eliminate the design rule
violations required to implement the "OPEN" structures that permit the
MEMS device release etch. Following the post-process open structure
etch, there will be a MEMS device release etch performed. This step
releases the MEMS structures to perform their mechanical
function. Lastly, MOSIS will provide specialized packaging options for
MEMS devices. All of the above services will become available at a
point in time when MOSIS has located contractors that can perform
these services for our customers. We do not have a projected date for
when this MEMS service will be available. Please check the MOSIS web
pages periodically for announcements on MEMS technology offerings in
the future.
At the present time, MOSIS can fabricate the basic CMOS devices in
only the AMIS ABN and
AMIS C5N processes
without encountering serious fabrication process problems. It is the
responsibility of the designer to perform the MEMS device release
etch.
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Related Links
Microelectronics Web Links
MEMS Clearing House
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