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MEMS
(Microelectromechanical Devices)


MOSIS offers access to PolyMUMPS, SOIMUMPS, and MetalMUMPS MEMS technology from MEMSCAP.

MOSIS is committed to providing access to CMOS-Compatible MEMS Technology at some point in the future. This future service will include a post CMOS process etch that will eliminate the design rule violations required to implement the "OPEN" structures that permit the MEMS device release etch. Following the post-process open structure etch, there will be a MEMS device release etch performed. This step releases the MEMS structures to perform their mechanical function. Lastly, MOSIS will provide specialized packaging options for MEMS devices. All of the above services will become available at a point in time when MOSIS has located contractors that can perform these services for our customers. We do not have a projected date for when this MEMS service will be available. Please check the MOSIS web pages periodically for announcements on MEMS technology offerings in the future.

At the present time, MOSIS can fabricate the basic CMOS devices in only ON Semiconductor's C5 process without encountering serious fabrication process problems. It is the responsibility of the designer to perform the MEMS device release etch.




Related Links
  • Microelectronics Web Links
  • MEMS Clearing House





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