Products > Fab Processes > IBM > IBM SIGe & CMOS Processes
7HP SiGe BiCMOS Process
IBM Semiconductor 0.18 Micron
Information vital to preparing and submitting a design for fabrication in this process has been
posted to the MOSIS Support System.
All users must read the checking procedures and density requirements described in this document.
If your design will be used for production, i.e. non-MPW, please read the IBM policy described in "Checking and Error Disposition Strategy for IBM Designs."
This BiCMOS SiGe process has 5 metal layers. Supply voltages are 1.8 V core and 2.5/3.3 V I/O. For reference, see the SiGe process comparison.
7HP Supported Options
Please refer to the List of 7HP Supported Options page for the options available on MOSIS MPW runs in this technology. You may not submit a design containing any options or metals stack which are not listed here without prior arrangement with MOSIS. Other configurations are available for dedicated runs or on MPW runs at an additional cost.
Design Considerations
To insure that submitted data is on a 20 nm grid, please stream-out at 1 DBU = 20 nm (Cadence 0.020, not 0.001).
MOSIS does not fill for IBM processes. Designs for IBM runs must meet the IBM fill requirements when submitted.
The CAD tool support files, DRC and LVS decks, simulation files, cell libraries, and files listed on the IBM SiGe Design Kits page are the only kits and files available.
Design rules supported by this technology
Only the IBM design rules will be supported for this technology.
MOSIS Technology Codes
The technology code for the 7HP process is IBM_7HP.
IBM SiGe BiCMOS
0.18 Micron
7HP Process
Wafer Size
(inches)
Reticle Size (milli- meters, approx.)
Reticle Copies Stepped on Wafer (approx.)
Turn- around Time*
Die Thickness
(+/- .5 mil)
Bumped Die Thickness **
(+/- .5 mil)
Wafer Thickness
Mils
Micro- meters
Mils
Micro- meters
Mils
Micro- meters
8
18 x 20
60
71
10
250
10
250
30
760
* Calendar days from release to manufacturing. Does not include
dicing/packaging/backlapping (for planning purposes only).
** Die thickness only. Does not include height of the bumps.
To order a special bumped die thickness, describe your requirements in the SPECIAL-HANDLING parameter of your New Project, Fabrication, or Update Request.
All users must read the checking procedures and density requirements described in this document.
If your design will be used for production, i.e. non-MPW, please read the IBM policy described in "Checking and Error Disposition Strategy for IBM Designs."
Process Description
MOSIS is offering access to the IBM 0.18 micron SiGe BiCMOS 7HP technology for prototype and low volume fabrication. C4 (IBM's flip chip bumping) is subject to availability at additional cost. Advance notice required. Please submit your inquiry through the MOSIS Support System.This BiCMOS SiGe process has 5 metal layers. Supply voltages are 1.8 V core and 2.5/3.3 V I/O. For reference, see the SiGe process comparison.
7HP Supported Options
Please refer to the List of 7HP Supported Options page for the options available on MOSIS MPW runs in this technology. You may not submit a design containing any options or metals stack which are not listed here without prior arrangement with MOSIS. Other configurations are available for dedicated runs or on MPW runs at an additional cost.
Design Considerations
To insure that submitted data is on a 20 nm grid, please stream-out at 1 DBU = 20 nm (Cadence 0.020, not 0.001).
MOSIS does not fill for IBM processes. Designs for IBM runs must meet the IBM fill requirements when submitted.
IBM Design Rules, Process Specifications, SPICE Parameters, and Cell Libraries
IBM has sub-licensed MOSIS to distribute this information to customers who have signed both the MOSIS customer agreement and the IBM Design Kit License Agreement.The CAD tool support files, DRC and LVS decks, simulation files, cell libraries, and files listed on the IBM SiGe Design Kits page are the only kits and files available.
Design rules supported by this technology
Only the IBM design rules will be supported for this technology.
MOSIS Technology Codes
The technology code for the 7HP process is IBM_7HP.
Parametric Test Results and SPICE Model Parameters
See Test Results for IBM 0.18 nanometer runsReticle/Wafer Size, Steps, Die and Wafer Thickness
0.18 Micron
7HP Process
(inches)
(+/- .5 mil)
(+/- .5 mil)
** Die thickness only. Does not include height of the bumps.
To order a special bumped die thickness, describe your requirements in the SPECIAL-HANDLING parameter of your New Project, Fabrication, or Update Request.