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8HP SiGe BiCMOS Process
IBM Semiconductor 0.13 Micron
8HP MPW Prices
Information vital to preparing and submitting a design for fabrication in this process has been posted to the MOSIS Secure Document Server.
All users must read the checking procedures and density requirements described in this document.
If your design will be used for production, i.e. non-MPW, please read the IBM policy described in "Checking and Error Disposition Strategy for IBM Designs."
Process Description
MOSIS is offering access to the IBM 0.13 micron SiGe 8HP technology for prototype and low volume fabrication. C4 (IBM's flip chip bumping) is subject to availability at additional cost. Advance notice required. Please submit your inquiry through the MOSIS Support SystemSupported Metal Stack:
M1, M2, M3 M4, MQ, AM
Supply voltage are 1.2/2.5 V core and 2.5 V I/O. The default stack is 7 metal layers - wirebond - (M1, M2, M3, M4M MQ, LY, AM) QY MiM. MOSIS supports 5LM, 6LM and/or C4 designs when possible - with sufficent advance notice to the MOSIS Support System
8HP Supported Options
Please refer to the List of 8HP Supported Options page for the options available by default on MOSIS MPW runs in this technology.
Other configurations are available for dedicated runs, or on MPW runs by prior arrangement. Please contact MOSIS support for additional details, e.g. costs.
Design Considerations
To insure that submitted data is on a 10 nm grid, please stream-out at 1 DBU = 10 nm (Cadence 0.010, not 0.001). MOSIS does not fill for IBM processes. Designs for IBM runs must meet the IBM fill requirements when submitted.
IBM Design Rules, Process Specifications, SPICE Parameters, and Cell Libraries
IBM has sub-licensed MOSIS to distribute this information to selected customers.The CAD tool support files, DRC and LVS decks, simulation files, cell libraries, and files listed on the IBM SiGe Design Kits page are the only kits and files available.
Design rules supported by this technology
Only the IBM design rules will be supported for this technology.
MOSIS Technology Codes
The technology code for the 8HP process is IBM_8HP.Parametric Test Results and SPICE Model Parameters
See Test Results for IBM 0.13 micron runsReticle/Wafer Size, Steps, Die and Wafer Thickness
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IBM SiGe 0.13 Micron
8HP Process |
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Wafer Size
(inches) |
Reticle Size (milli- meters, approx.) | Reticle Copies Stepped on Wafer (approx.) | Turn- around Time* |
Die Thickness
(+/- .5 mil) |
Bumped Die Thickness **
(+/- .5 mil) |
Wafer Thickness | |||
| Mils | Micro- meters | Mils | Micro- meters | Mils | Micro- meters | ||||
| 8 | 18 x 20 | 60 | 71 | 10 | 250 | 10 | 250 | 30 | 760 |
** Die thickness only. Does not include height of the bumps.
To order a special bumped die thickness, describe your requirements in the SPECIAL-HANDLING parameter of your New Project, Fabrication, or Update Request.