MOSIS FAQs: IC Packaging

The most frequently asked questions about packaging available through MOSIS.

1.0 How Do I Request These Packaging Options

1.1 Unpackaged parts

1.2 Combination of packaged and unpackaged parts

1.3 More parts than the minimum for that process

1.4 Use of a customer-supplied bonding diagram

1.5 Use of customer-supplied packages

1.6 Special orientation of my circuit in the package

1.7 Sealing of package lids

1.8 Downbond to the package cavity

1.9 Bonding only SOME of my pads

1.10 MOSIS standard frames

1.11 A specific or minimum die size

2.0 Can I Order The Following From MOSIS?

2.1 Assembly in ceramic packages

2.2 Assembly in plastic packages

2.3 Packages and lids (materials only)

2.4 Assembly of parts not fabricated by MOSIS

2.5 Printed circuit boards

2.6 MCM devices

2.7 Flip chip (bump) assembly

2.8 Testing services

3.0 How does MOSIS select a package for my parts?

4.0 Can I tell MOSIS which package to use?

5.0 Can I receive parts sooner if I don't have them packaged?

6.0 Can I receive parts sooner if I pay more money?

7.0 Can I save money by ordering unpackaged parts?

8.0 What layout does MOSIS recommend for bonding pads?

9.0 Does using a guard ring affect pad spacing?


1.0 How Do I Request These Packaging Options

1.1 Unpackaged parts

To request that NONE of your parts be packaged, include the following parameter in your NEW_PROJECT or FABRICATE request. PACKAGE: NONE For more information, see: Unpackaged Parts.

1.2 Combination of packaged & unpackaged parts

To request that only some of your parts be packaged, include BOTH of the following parameters in your NEW_PROJECT or FABRICATE request. PACKAGE: ? (where "?" is the quantity to package) UNPACKAGED: ? (where "?" is the quantity to leave unpackaged) For more information, see: Unpackaged Parts.

1.3 More parts than the minimum quantity for that process

If you wish to order more than the minimum quantity of parts listed on the Prototype Lot Quantities page, include the following parameter in your NEW_PROJECT or FABRICATION request QUANTITY: ? (where "?" is TOTAL quantity of parts you are ordering) Note that you must order at least the minimum quantity of parts noted on the Prototype Lot Quantities page. If you wish to order more than the minimum, you must order a multiple of the lot quantity listed for that process, or request a custom price quote for quantities over 100.

1.4 Use of a customer-supplied bonding diagram

If you wish to supply your own bonding diagram, select "Customer" in the "Bonding Diagram Supplier" field of your NEW_PROJECT, FABRICATION, or UPDATE request. Send your initial bonding diagram to MOSIS no less than two business-days before your target run is scheduled to begin. For more information, see Telling MOSIS Which Package to Use.

1.5 Use of customer-supplied packages

If you wish to supply your own packages, include this request in the SPECIAL_HANDLING parameter in your NEW_PROJECT or FABRICATION request, and send your packages to MOSIS no less than two business-days before the run is scheduled to close

For more information, see Customer-Supplied Packages.

1.6 Special orientation of my circuit in the package

You can specify the orientation of your design in the package cavity by supplying a bonding diagram that clearly indicates how the design should be oriented in the package cavity during assembly. For more information see Design Orientation and Use of Customer-Supplied Bonding Diagram.

1.7 Sealing of package lids

If you wish to have the lids on your ceramic packages sealed, include this request in the SPECIAL_HANDLING parameter in your NEW_PROJECT or FABRICATION request

Note that lids for parts in plastic packages must always be sealed. The following lid options are available for ceramic packages:

  • Taped lids (the MOSIS default for ceramic packages)
  • Hermetically sealed lids
  • Semi-epoxy sealed lids
  • Full-epoxy sealed lids

For more information, see Lids (Taping or Sealing).

1.8 Downbond to the package cavity

If you wish to request a downbond in your packages, include this request in SPECIAL_HANDLING parameter when you send your NEW_PROJECT or FABRICATION request to MOSIS.

For more information, see Downbond.

1.9 Bonding only SOME of my pads

Projects designed using MOSIS SCMOS rules can use an optional layer (called XP in CIF and numbered 26 in GDSII) to define which pads are to be bonded and which are not. This layer is valid ONLY in MOSIS SCMOS rules. For more information, see MOSIS scalable (SCMOS) design rules (search for XP).

For projects designed using vendor rules, please provide a bonding diagram. For more information, see Bonding Diagrams.

1.10 MOSIS standard frames

Standard frames have been phased out by MOSIS.

1.11 A specific or minimum die size

To request a special or minimum die size to facilitate packaging (or for other reasons) see die size.

2.0 Can I order the following from MOSIS?

2.1 Can I order assembly in ceramic packages?

Assembly of parts in ceramic packages is available from MOSIS. See MOSIS Ceramic Packaging Options.

2.2 Can I order assembly in plastic packages?

MOSIS offers Open Cavity Plastic (OCP) and Fully Encapsulated Plastic packages.

2.3 Can I order packages and lids (materials only)?

It is sometimes possible to purchase small quantities of packages and lids from MOSIS, but packaging materials are not a standard MOSIS product, and the part you need might not always be available. If you wish to purchase packages or lids from MOSIS, send us a quote request that includes the manufacturer, part number and quantity required. Quote requests should be submitted through the MOSIS Customer Support System (your email address is your user ID in that system).

Instead of ordering through MOSIS, you may wish to order materials directly from one of the suppliers MOSIS works with:

Coors Technical Ceramics: 800-821-6110

Kyocera America: 858-576-2600

Spectrum Semiconductor: 408-435-5555

2.4 Can I order assembly of parts not fabricated by MOSIS?

Assembly of parts not fabricated by MOSIS is not a service currently offered by MOSIS. Some packaging vendors will assemble small quantities of parts, but there is often a minimum charge, which could be as high as several hundred dollars. Here are some assembly vendors MOSIS has worked with:

I2A Technologies (formerly IPAC): 408-321-3600

Corwil/Integra Technologies: 408-321-6404

Promex Industries, Inc. 408-496-0222

2.5 Can I order printed circuit boards?

MOSIS does not offer printed circuit board fabrication because it is more efficient and cost effective for designers to contract directly with board manufacturers. We can, however, give you the name of some suppliers we have worked with:

American Technology Services
1312 East 29th Street, Signal Hill CA 90806
Phone: 562-426-0521 | Fax: 562-426-2560

Multilayer Technology Inc (Multek)
16 Hammond, Irvine, CA 92718
Phone: 949-951-3388 | Fax: 949-951-5431

2.6 Can I order MCM devices

MOSIS does not currently offer MCM fabrication, but that may change in the future. If you would like MOSIS to offer that service, please let us know by sending us a message through the MOSIS Customer Support System.

2.7 Can I order flip-chip (bump) assembly

MOSIS offers flip-chip bumping. Since bumping requirements vary, please submit a description of your requirements by sending a message through the MOSIS Customer Support System.

2.8 Can I order testing services

Functional testing (digital) is available from MOSIS, and quotes are provided on a case-by-case basis. Functional testing quote requests should be sent through the MOSIS Customer Support System.

3.0 How does MOSIS select a package for my parts?

Parts packaged by MOSIS must fit within the cavity of a standard MOSIS or customer-supplied package and must meet normal wire bonding requirements. Considerations include the following:

  • Project size
  • MOSIS overhead
  • Buffer (project edge to scribe lane spacing)
  • Package cavity
  • Die edge to package cavity spacing

For more information, see Die Size.

4. Can I tell MOSIS which package to use?

You can dictate the package type and pad-to-pin assignments by providing MOSIS with a bonding diagram. Bonding diagram templates for MOSIS ceramic packages are available on the MOSIS web site (see MOSIS Ceramic Packaging Options). Note that when you prepare the bonding diagram, you must draw your die to scale with respect to the package cavity.

If you wish to supply your own bonding diagram, select "Customer" in the "Bonding Diagram Supplier" field of your NEW_PROJECT, FABRICATION, or UPDATE request.

Initial bonding diagrams are due at MOSIS no less than two business-days before your target run is scheduled to close. They must be labeled with (A) the MOSIS Design ID (like 12345), (B) the project name, and (C) the MOSIS account number, and sent to:

MOSIS Packaging Manager
Fax: 310-823-5624

5. Can I receive parts sooner if I don't have them packaged?

Unfortunately, the answer is no, because we receive packaged and unpackaged parts from our assembly vendor at the same time.

6. Can I receive parts sooner if I pay more money?

If you wish to pay additional money to expedite your order, you can do one of two things: (A) pay $20 extra for overnight delivery, or (B) pay thousands of dollars extra to expedite wafer processing (option B is not always available). For more information, see Submitting Purchase Orders to MOSIS.

7. Can I save money by ordering unpackaged parts?

Yes, because fabrication and packaging are priced separately.

8. What layout does MOSIS recommend for bonding pads?

The minimum recommended pad layout for wire bonding is a 90 x 90 micron (3.5 x 3.5 mils) glass cut box over a 100 x 100 (3.9 x 3.9 mils) micron top metal box. For more information, see Bonding Pad Layout and Placement.

9. Does using a guard ring affect pad spacing?

Use of a guard ring does not affect pad spacing. Rather than discuss pad spacing we prefer to discuss pad size and pitch. Pad size/pitch is a packaging issue not a processing one. Our general recommendation is that pads are 100 µm x 100 µm with a pitch of 170 (allows for pad edge to pad edge spacing of 70 µm). Smaller pads and tighter pitch is possible but not without considering the exact location of the package cavity pins, angle of wire to the pins and length of the wires.