> Wafer and Die Thickness
Wafer and Die Thickness
When we order wafers for fabrication, they return with a default wafer thickness set by that foundry.
The wafers are then sent to a packaging vendor for dicing and assembly. The packaging vendor backgrinds each wafer to die thickness prior to dicing the wafer. The die thickness has to satisfy the packaging requirements of all the customers on a multi-project run.
Send a messaage through the MOSIS Support System if these thicknesses do not meet your requirements.
Customers on dedicated runs can dictate a thickness up to that provided by the vendor.