ON Semiconductor Design Rules

Process Specifications, and SPICE Parameters

ON Semiconductor has sub-licensed MOSIS to distribute ON Semiconductor's design rules, SPICE parameters, and technology files to customers of MOSIS who do not have a MyAMIS or MyON account. SPICE parameters may be used as design references, but no quantity derived from a simulation should be treated as a manufacturing tolerance. ON Semiconductor considers these items to be proprietary and only authorizes MOSIS to distribute them to customers who have established MOSIS commercial accounts and who have signed the MOSIS Customer Agreement, which includes the following terms in Section 6C:

EACH PARTY SPECIFICALLY AGREES THAT IT SHALL NOT DISCLOSE ANY MATERIAL WHICH MAY BE CONSIDERED PROPRIETARY OR CONFIDENTIAL MATERIAL OF THE OTHER PARTY OR OF ANY VENDORS TO ANY THIRD PARTIES. PROPRIETARY MATERIAL SHALL INCLUDE BUT SHALL NOT BE LIMITED TO, PROPRIETARY VENDOR INFORMATION SUCH AS YIELD AND PARAMETRIC DATA, WHETHER IT WAS PROVIDED TO CUSTOMERS OR EXTRACTED BY THEM. EACH PARTY AGREES THAT IT SHALL BE PRECLUDED BY 18 U.S.C. 1905 AND ANY AND ALL OTHER APPROPRIATE LAWS AND REGULATIONS FROM KNOWINGLY DIVULGING THE TRADE SECRETS OF THE OTHER PARTY, AND/OR ANY THIRD-PARTY VENDOR.

Procedures

To obtain any of these items you must have an account with MOSIS To open a commercial account with MOSIS, complete and send the Commercial Account Application along with all appropriate signed agreements. Please read the instructions carefully before submitting the application package.

In addition, customers need to first submit on-line the Access Request Form, and then execute the following agreements

  • Confidentiality Agreement (CDA)
  • Design Kit License Agreement (DKLA)

If the customer already has MyAMIS access, MOSIS document access is not needed.


Special instructions for academic institutions

Along with the access request form, the DKLA, and the CDA. academic institutions must also submit the Academic Account Document Access Application, which contains the following:

  • Account Information
  • Fabrication Plan
  • Account Liaison NDA
  • List of students, staff, and other faculty that have signed the individual NDA.
  • Additionally, a Mini-Proposal may be requested.

Specific Process Pages
(feature size in micrometers)

C5
(0.50)